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ACS244MS
March 1998
Radiation Hardened Non-Inverting, Octal, Three-State Buffer/Line Driver
Description
The Radiation Hardened ACS244MS is a Non-Inverting, Octal, Three-State Buffer/Line Driver with two active-LOW Enable inputs (AE and BE). Each Enable input controls four outputs. When an Enable input is LOW, the corresponding outputs are active. A HIGH on an Enable input causes the corresponding outputs to be high impedance, regardless of the input levels. The ACS244MS is fabricated on a CMOS Silicon on Sapphire (SOS) process, which provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices offer significant power reduction and faster performance when compared to ALSTTL types. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the ACS244 are contained in SMD 5962-98541. A "hot-link" is provided on our homepage with instructions for downloading. http://www.intersil.com/data/sm/index.htm
Features
* QML Qualified Per MIL-PRF-38535 Requirements * 1.25Micron Radiation Hardened SOS CMOS * Radiation Environment - Latch-up Free Under any Conditions - Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si) - SEU Immunity . . . . . . . . . . . <1 x 10-10 Errors/Bit/Day - SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm2) * Input Logic Levels . VIL = (0.3V)(VCC), VIH = (0.7V)(VCC) * Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 16mA * Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20A * Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . 9.0ns
Applications
* Databus Driving * Data Routing * Redundant Data Control Circuitry
Ordering Information
SMD PART NUMBER 5962F9854101VRC N/A 5962F9854101VXC N/A N/A INTERSIL PART NUMBER ACS244DMSR-02 ACS244D/Sample-02 ACS244KMSR-02 ACS244K/Sample-02 ACS244HMSR-02 TEMP. RANGE (oC) -55 to 125 25 -55 to 125 25 25 PACKAGE 20 Ld SBDIP 20 Ld SBDIP 20 Ld Flatpack 20 Ld Flatpack Die CASE OUTLINE CDIP2-T20 CDIP2-T20 CDFP4-F20 CDFP4-F20 N/A
Pinouts
ACS244 (SBDIP) TOP VIEW
AE AI1 BO4 AI2 BO3 AI3 BO2 AI4 BO1 1 2 3 4 5 6 7 8 9 20 VCC 19 BE 18 AO1 17 BI4 16 AO2 15 BI3 14 AO3 13 BI2 12 AO4 11 BI1 AE AI1 BO4 AI2 BO3 AI3 BO2 AI4 BO1 GND
ACS244 (FLATPACK) TOP VIEW
1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC BE AO1 BI4 AO2 BI3 AO3 BI2 AO4 BI1
GND 10
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 1999
File Number
4479
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ACS244MS Die Characteristics
DIE DIMENSIONS: Size: 2540m x 2540m (100 mils x 100mils) Thickness: 525m 25m (20.6 mils 1 mil) Bond Pad: 110m x 110m (4.3 x 4.3 mils) METALLIZATION: Al Metal 1 Thickness: 0.7m 0.1m Metal 2 Thickness: 1.0m 0.1m SUBSTRATE POTENTIAL: Unbiased Insulator PASSIVATION Type: Phosphorous Silicon Glass (PSG) Thickness: 1.30m 0.15m SPECIAL INSTRUCTIONS: Bond VCC First ADDITIONAL INFORMATION: Worst Case Density: <2.0 x 105 A/cm2 Transistor Count: 214
Metallization Mask Layout
ACS244MS
AI1 (2) AE (1) VCC (20) VCC (20) BE (19)
(18) AO1 BO4 (3) (17) BI4 AI2 (4) (16) AO2 BO3 (5) (15) BI3 AI3 (6) (14) AO3 BO2 (7) (13) BI2 AI4 (8)
BO1 (9) AO4 (12)
(10) (10) GND GND
(11) BI1
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
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